Cooling embedded computing systems for military vehicles, weapon systems, and other platforms is becoming increasingly challenging each year. The newest generation of COTS modules and AI-centric processors are smaller and more capable than their predecessors. However, these newer designs are susceptible to overheating — especially with some newer 3U OpenVPX modules operating in the 50W-75W range, while other GPUs and high-end FPGAs can reach 175W. These OpenVPX architectures, defined and maintained under VITA standards such as VITA 46 and VITA 48, continue to evolve to support higher power densities and corresponding thermal-management requirements. Thermal loads are ramping up faster than ever.
This 60-minute webinar from the editors of Aerospace & Defense Technology will feature a panel of industry experts discussing new approaches to cooling modern embedded computing systems that are operating inside of today’s aerospace and defense platforms. An audience Q&A session will follow the technical presentation.
Highlights include:
- Key thermal challenges for rugged embedded computing
- Cooling approaches in rugged systems
- The critical role VITA plays in enabling interoperable, standards-based cooling solutions
- High-performance liquid-cooling approaches like 6U VPX LFT that are defined by VITA
